We are currently interested in electronic packaging, microwave theory and measurements, and digital circuit modeling. We also investigate the integration of modeling and simulation tools and high-performance computation for simulation of packages.

Electromagnetics

Simulation of high-speed digital circuits

Electronic packaging

Interconnect technology

Low-cost Fully Monolithic RF Integrated Circuits for Wireless Applications.

CAD Tools for Communications Microsystems

High-Frequency Measurements and Validation of Electromagnetic Models
     in Scattering Interconnects, and Optoelectronics

High-Performance Computing for the Electromagnetic Modeling
     of Interconnects and Packages

Modeling and Simulation of Embedded Transmission Line Structures

Design and Fabrication of MEMS Probe Station

Development and Modeling of Flip Chip and Interconnect Package Technology
     for Ka and W Band

National Course in Signal Integrity

 List of the past and present members of Professor Schutt-Ainé's Research Group.